VSOP
very-small-outline (IC) package
超小型外形半導体集積回路(IC). ICのパッケージの型.
very-small-outline (IC) package; an IC(integrated circuit) package; a quarter size dual in-line package with a 0.65 mm pin pitch; includes as subsets USOP and TSOP(EIA Japan); ref. SOP and DIP;
[C].
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